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| KOA SPEER ELECTRONICS, INC. SS-195 R6 AHA 6/29/06 Power Chip Inductors Type LPC9040N 1. Scope This specification shall be applied to the LPC9040N manufactured by KOA Corporation. CERTIFIED CERTIFIED 2. Dimensions and Construction B Size 456 C A F Ferrite Core Magnet Ceramic Wire Substrate Electrode A +.002 Dimensions inches (mm) B C D F R D 1 9040N o.354 -.004 .193 Max. .402 Max. .079.008 .071.008 . (o9.0 +0.05) (4.9 Max.) (10.2 Max.) (2.00.2) (1.80.2) -0.1 3. Type Designation The type designation shall be the following form: New Type LPC Type 9040N Size A Termination Material A: SnAg (Other termination styles available, contact factory for options) TED Packaging TED: 10" Embossed Plastic 500 pcs/reel 101 Nominal Inductance 101: 100H 221: 220H 152: 1500H K Tolerance K: 10% M: 20% 9040N PAGE 1 OF 4 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-195 R6 4. Standard Applications Part Designation LPC9040NATED100M LPC9040NATED150K LPC9040NATED220K LPC9040NATED330K LPC9040NATED470K LPC9040NATED680K LPC9040NATED101K LPC9040NATED151K LPC9040NATED221K LPC9040NATED331K LPC9040NATED471K LPC9040NATED681K Inductance (H) 10 15 22 33 47 68 100 150 220 330 470 680 Inductance Tolerance M: 20% Quality Factor Minimum (MHz) 40 30 20 K: 10% 10 Self Resonant Frequency Minimum (MHz) 25.0 21.0 15.0 13.5 11.5 10.0 8.0 7.0 5.0 3.3 2.8 1.2 DC Resistance Maximum () 0.07 0.09 0.11 0.14 0.20 0.27 0.41 0.55 0.81 1.86 2.07 2.65 Allowable DC Current Maximum (Amps) 1.55 1.40 1.25 1.10 0.99 0.91 0.70 0.60 0.50 0.29 0.22 0.14 Measured Frequency (Hz) 10 kHz 5. Rating No. 1 Item Nominal inductance range Specification 10 ~ 680 H (E-6 series) Heat fluctuation of DC resistance shall be calculated to 20C using 0.4% for each 1C. Measuring Conditions: Normal testing is conducted at normal temperatures (5C ~ 35C) and at nominal humidity (45% ~ 85% R. H.). If there is concern, the test may be conducted at a temperature of 20 2C and at a relative humidity of 65 5% R. H. 6. Environmental Characteristics No. 1 2 3 4 5 6 7 8 9 10 Item High temperature, leaving test Low temperature, leaving test Moisture leaving test Heat shock test Vibration test Temperature Characteristics Operating temperature range Storage temperature range Resistance to soldering heat Resistance to solvent Test Methods 85 2C 500 Hr -40 2C 500 Hr 40 2C 90 ~ 95% R. H. 500 Hr -25 2C/0.5 Hr 85 2C/0.5 Hr 85C 0.5 Hr 100 cycles -25C 2 hours in each direction of X, Y, Z at a frequency range of 10 ~ 55 Hz with 1.5 mm /min. Standard Within 5% Within 5% Within 5% Within 5% Within 5% -40C/+85C Reference to L at +25C Within 10% -30C ~ +80C -40C ~ +85C With the temperature of the solder at 260 5C, soak for 10 1 seconds. There shall be no abnormalities. MIL-STD-202F Method 215 There shall be no abnormalities under the above conditions. Measurement: Inductance HIOKI 3520 DC Superposed characteristics LCR Meter YHP 4262A DC Resistance HIOKI 3520 Frequency: Inductance 1 KHz DC Superposed characteristics 10 KHz PAGE 2 OF 4 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-195 R6 7. Packaging 7.1 Direction of Travel Perform taping so that the grooved section (R1) is in the opposite direction of travel. 7.2 Taping The tapes for taping shall be embossed carrier tapes of 16 mm width and 12 mm pitches. The standard quantity per reel shall be 500 pieces. 7.3 Dimensions of Carrier Tape Top tape seperation strength: 20 ~ 70 g. 1.75 0.05 2.0 0.05 4.0 0.1 o1.5+0.1 -0 2.0 0.05 2.2 0.1 Terminal 1 start o4.0 0.1 7.5 Markings The following information is provided on the reel. (1) Product name (2) Part number (3) Quality (4) Lot number (5) Manufacture origin 7.5 0.05 2 0.5 o13 0.5 o80 (unit: mm) 16.0 0.3 o9.4-0.2 Terminal 2 0.3 0.1 2.0-0.2 +0 1.0-0.2 +0 +0 45 12.0 0.1 o21 0.8 o380 2.0 17.0 (unit: mm) 7.6 Packaging Method A specially designed cardboard box is used for the external packaging and can hold a maximum of 15 reels. ... ... Empty Heat 7.4 Packaging Method End ... ... ... .. ... .. Filled 7.7 Lot Number Tape leader Empty 40 mm min. (Example) January 21, 2006 500 pieces 50 mm min. 150 mm min. Feed Direction 41 Year and Month of Manufacture 21 D K Additional Number Manufacture Day of Plant Manufacture 41...2006.1 42...2006.2 43...2006.3 PAGE 3 OF 4 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-195 R6 8. General Information 8.1 Storage Chip inductors shall not be stored under high temperature and high humidity conditions. Especially, do not store taping where they are exposed to heat or direct sunlight, otherwise, material may be deformed, causing problems during mounting. 8.2 Mounting Placement force should not be excessive. 8.3 Soldering When using a soldering iron, temperature shall not exceed 350C and within 3 seconds. Soldering iron time shall be allowed only one time. After soldering, chip inductors shall not be stressed excessively. 8.4 Cleaning There is no problem using organic solvents. Since these chip inductors are a coil of ultra-thin wire, they are susceptible to vibration. If an ultrasonic cleaning unit is used, check for any possibility of problem generation before practical use, since such cleaning units differ considerably in vibration level and mode. Although the conditions vary depending on the printed board size, Ultrasonic cleaning is generally used in the conditions described in the following examples: Power: Within 20W/L Cleaning times: Within 5 minutes 8.5 Pattern Design When low or more chip inductors are closely mounted, they must be separated by means of solder resists to prevent excessive solder. 9. Soldering 9.1 Conditions for Reflow Soldering The time and temperature for reflow solder applications are as shown below. Temperature (C) 230 10. Land Pattern Design (unit: mm) 11. Packaging Box (unit: mm) Content marking 380 200 160 Time Within 90 seconds Within 30 seconds Within 45 seconds Within 6 seconds 2.6 0.2 4.0 0.2 3.0 0.2 380 7 PAGE 4 OF 4 Bolivar Drive I P.O. Box 547 I Bradford, PA 16701 I USA I 814-362-5536 I Fax 814-362-8883 I www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. |
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